This paper provides a comprehensive technical analysis of the four dominant paradigms in this evolution: Pluggable Optics, On-Board Optics (OBO), Near-Packaged Optics (NPO), and Co-Packaged Optics (CPO). Unlock AI-driven, actionable R&D insights for your next breakthrough. Patsnap Eureka helps you evaluate technical feasibility & market potential. Co-packaged optics (CPO) represents a paradigm shift in optical interconnect technology, emerging from the relentless demand for higher bandwidth density. OFC 2025 made one thing clear: The transition to Co-Packaged Optics (CPO) switches in data centres is inevitable, driven primarily by the power savings they offer. From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC. EE World discussed with GlobalFoundries' Anthony Yu trends and tradeoffs in co-packaged optics and silicon photonics resulting from the rising data demand that AI thrusts upon us. It's coming down to speed versus reliability, at least for now. The demand for data always increases. Traditional copper-based interconnects face severe bandwidth-distance limitations and unsustainable power consumption at scale. Core Component. The rich selection of pluggable form factor modules now on the market has given designers more I/O options and flexibility, both copper and fiber optic. New applications constantly push the limits of this technology.
