Industry Here, we demonstrate a silicon-based optical coherent dot-product chip (OCDC) capable of completing deep learning regression tasks. The OCDC adopts optical fields to carry out operations in complete
Industry A team of engineers has developed a new kind of computer chip that uses light instead of electricity to perform one of the most power-intensive parts of artificial intelligence — image
Industry Here we introduce an analog optical computer (AOC) that combines analog electronics and three-dimensional optics to accelerate AI inference and
Industry Inference chips have become a necessary choice in this context. The core task of AI inference is to execute forward-pass calculations of pre-trained models, involving matrix
Industry AI processing chips (GPUs) exchange data at about 10 times the rate of a general-purpose processor chip. Copper has been the preferred conduit because it''s reliable and requires no
Industry AI processing chips (GPUs) exchange data at about 10 times the rate of a general-purpose processor chip. Copper has been the preferred conduit
Industry Here, we present a photonic edge intelligence chip (PEIC) that fuses multiple analog modalities—images, spectra, and radio-frequency signals—into broad optical spectra for single-fiber
Industry Optical modules convert electrical signals into light to move data quickly and reliably in AI systems, enabling fast and smooth data processing. Using advanced optical modules boosts AI
Industry Here we introduce an analog optical computer (AOC) that combines analog electronics and three-dimensional optics to accelerate AI inference and combinatorial optimization in a single platform.
Industry The Cisco Silicon One G300 102.4 Tbps switch silicon can power gigawatt-scale AI clusters for training, inference, and real-time agentic workloads, while maximizing GPU utilization
Industry We introduce optically connected multi-stack HBM modules, a separate chip package with multiple HBM stacks and connected to the compute chip via co-packaged optics.
Industry In-package and chip-to-ship optical interconnect not only promise to support the computational bandwidth that AI data centres demand, but they can also reduce latency, heat
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