IDTechEx's report titled "Co-Packaged Optics (CPO) 2026 to 2036: Technologies, Market, and Forecasts" examines this transition in detail. Supports 32 to 64 Tbps of aggregate bandwidth through co-packaged optics, using 112G PAM4 signaling to enable dense and fast interconnects. Accelerate your optics integration roadmap. It reviews recent advances in CPO technology, tracks emerging packaging approaches, assesses the strategies of leading companies, and provides long term market. SCALE CPO solution is the industry's first OCI MSA capable platform and built with GF's proven silicon photonics technology MALTA, N., May 4, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO). GF's SCALE. Co-Packaged Optics (CPO) is an advanced optical interconnect architecture that integrates optical components—such as photonic integrated circuits (PICs) and lasers—directly alongside switching ASICs or processors within the same package. This approach significantly reduces electrical I/O distance. Yole Group unveils its latest photonic market and technology analyses, Silicon Photonics 2025 and Co-Packaged Optics for Data Centers 2025, which explore how AI-driven demand is reshaping connectivity, from transceivers to packaging innovation. Replacing pluggable transceivers with silicon photonics on the same package as the ASIC, NVIDIA CPO innovations provide 5x better power.